Artificial Intelligence: On one hand, Artificial Intelligence is developing very fast. On the other hand, a small technology is becoming a hindrance in its speed. Yes, in fact, the way AI has spread its foot in this world of technology is not hidden from anyone. Today, AI is being used rapidly in almost most of the tasks. In such a situation, a small technology which most people did not pay attention to has today become a matter of concern for big tech companies and governments.

What is Advanced Chip Packaging?

According to media reports, earlier semiconductor companies used to add more power to a chip by reducing the size of transistors. But now this method has reached its peak. In such a situation, companies like Nvidia are resorting to advanced packaging to combine many different chips and high-speed memory in a single package.

With the help of this technology, very powerful AI processors can be made even in small sizes which are capable of handling large AI models.

What is chip packaging?

For your information, let us tell you that after the chip is ready, the job of packaging is to make it secure, connect it to other chips and circuits and ensure fast data transfer.

Advanced AI chips use special silicon layers, interposers and substrates to combine multiple processors and high-bandwidth memory into a single module. This technology increases the real power of AI processor.

Increased dependence on Taiwan

Actually, University of California, Los Angeles (UCLA) professor and former IBM engineer Subramanian Iyer has been working on this technology for many years. He believes that America has lost its hold in this region and now it too will have to depend on a country like Taiwan.

Let us tell you that today most of the companies making advanced AI chips are dependent on Taiwan’s TSMC (Taiwan Semiconductor Manufacturing Co.). This company not only manufactures the world’s most advanced chips but also does their advanced packaging. This is the reason why most of the suppliers are present in Taiwan only and due to this the threat to the supply chain is also increasing.

Demand for AI is becoming the reason

According to the information, the rapidly increasing demand for AI has also taken the demand for advanced packaging to a record level. But now even TSMC does not seem to be able to meet this demand. In such a situation, it is believed that the company’s CoWoS packaging strength is still much less than the market requirement.

This is directly affecting the availability of AI chips and their prices. Many companies are facing delays in preparing new AI processors.

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